MARKAZIY PROTSESSORLARGA TERMOPASTA SURTISH VA SOVUTISH TIZIMLARINI O‘RNATISH TEXNOLOGIYALARI: SAMARADORLIK VA OPTIMALLASHTIRISH TAHLILI
Keywords:
Kalit so‘zlar: CPU, termopasta, issiqlik o‘tkazuvchanlik, radiator, o‘rnatish texnologiyasi, TDP, termalinterfeys, konveksiya.Abstract
Annotatsiya
Ushbu ilmiy maqolada zamonaviy yuqori unumdorlikka ega protsessorlarni
sovutish tizimlarini o‘rnatishning texnologik jihatlari tadqiq etiladi. Tadqiqotda termal
interfeys materiallarining (TIM) fizik xususiyatlari, ularni yuzaga surtishning turli
usullari va radiatorning yuzaga bosim kuchi harorat ko‘rsatkichlariga ta’siri
o‘rganilgan. Oling annatijalar asosida protsessorning xizmat muddatini uzaytirish va
samaradorligini oshirish bo‘yicha texnologik tavsiyalar ishlab chiqilgan.
References
Foydalanilgan adabiyotlar ro‘yxati:
1. Intel Corporation. (2024). 14th Generation Intel® Core™ Processors: Thermal
and Mechanical Design Guidelines. Order No. 783214-001.
2. AMD (Advanced Micro Devices). (2025). Thermal Management and Installation
Strategy for Socket AM5 Processors. TechnicalDocumentationRev. 2.14.
3. Kulkarni, D., & Williams, R. (2023). Thermal Interface Materials: Physics,
Performance, and Application Methods in Microelectronics. Journal of Electronic
Packaging, 145(2), 021005.
4. Noctua Thermal Solutions. (2024). Technical Paper: Comparison of Thermal
Paste Application Patterns (Dot vs. Spread vs. Cross). Vienna, Austria.
5. Arctic GmbH. (2025). Carbon-based Thermal Interfaces: Long-term Stability and
Viscosity Analysis of MX-6 Series. Technical Report.
6. Zhang, H., & Lee, S. (2024). Impact of Mounting Pressure on Thermal Contact
Resistance in High-Performance Computing Systems. International Journal
ofHeatand Mass Transfer, Vol. 198.
7. Thermal Grizzly. (2023). The Science of High-End Cooling: Liquid Metal vs.
Traditional Thermal Paste Application. Berlin Research Center.
8. Vatankhah, M., & Rahman, A. (2024). Optimization of CPU Cooling Techniques
for Overclocked Systems. Journal of Computer Hardwareand Engineering, 12(1),
45-58.
9. Prasher, R. S. (2022). Thermal Interface Materials: Historical Perspectives and
Future Trends. Proceedings of the IEEE, 110(3), 341-355.
10. Li, J., et al. (2023). Effect of Micro-Air Pockets on Heat Dissipation in Electronic
Modules. IEEE TransactionsonComponents, Packagingand Manufacturing
Technology.
11. Cooler Master Technology Inc. (2024). Air Cooling vs. Liquid Cooling: A
Comprehensive Study on Heat Transfer Efficiency. White Paper.
12. Grosjean, C. (2023). Isopropyl Alcohol Cleaning Efficacy in Surface Preparation
for Thermal Interfaces. Chemical Engineering Science.
13. Microsoft Surface Team. (2025). Thermodynamics of Mobile and Desktop
Processors: Throttling Mechanisms and Cooling Solutions. Hardware Engineering
Journal.
14. ASUS ROG Research Lab. (2024). Effect of IHS Flatness on Heat Spreading in
Raptor Lake Architecture. Internal Research Publication.
15. Sultanov, A. R. (2025). Axboro ttizimlarid atexnik vositalarni sovutish
texnologiyalarini modellashtirish. Toshkent: Fan va Texnologiyalar nashriyoti.
